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 SUD50N03-06P
Vishay Siliconix
N-Channel 30-V (D-S) 175_C MOSFET
PRODUCT SUMMARY
VDS (V)
30
FEATURES
ID (A)b
84b 59b
rDS(on) (W)
0.0065 @ VGS = 10 V 0.0095 @ VGS = 4.5 V
D TrenchFETr Power MOSFET D 175_C Junction Temperature D Optimized for Low-Side Synchronous Rectifier Operation
APPLICATIONS
D DC/DC Converters D Synchronous Rectifiers
D
TO-252
G Drain Connected to Tab G D S
Top View Order Number: SUD50N03-06P S N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Currenta Pulsed Drain Current Continuous Source Current (Diode Conduction)a TC = 25_C Maximum Power Dissipation Operating Junction and Storage Temperature Range TA = 25_C PD TJ, Tstg TC = 25_C TC = 100_C ID IDM IS
Symbol
VDS VGS
Limit
30 "20 84b 59b 100 25 88 8.3a - 55 to 175
Unit
V
A
W _C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction to Ambienta Junction-to-Ambient Maximum Junction-to-Case Notes a. Surface Mounted on FR4 Board, t v 10 sec. b. Based on maximum allowable Junction Temperature, package limitation current is 50 A. Document Number: 71844 S-31268--Rev. B, 16-Jun-03 www.vishay.com t v 10 sec Steady State RthJA RthJC
Symbol
Typical
15 40 1.4
Maximum
18 50 1.7
Unit
_C/W C/W
1
SUD50N03-06P
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter Static
Drain-Source Breakdown Voltage Gate Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain Currentb Drain Source On State Drain-Source On-State Resistanceb Forward Transconductanceb V(BR)DSS VGS(th) IGSS IDSS ID(on) rDS(on) gfs VGS = 0 V, ID = 250 mA VDS = VGS, ID = 250 mA VDS = 0 V, VGS = "20 V VDS = 30 V, VGS = 0 V VDS = 30 V, VGS = 0 V, TJ = 125_C VDS = 5 V, VGS = 10 V VGS = 10 V, ID = 20 A VGS = 10 V, ID = 20 A, TJ = 125_C VGS = 4.5 V, ID = 20 A VDS = 15 V, ID = 20 A 20 0.0078 50 0.0053 0.0065 0.0105 0.0095 S W 30 1.0 3.0 "100 1 50 V nA mA A
Symbol
Test Condition
Min
Typa
Max
Unit
Dynamica
Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance Total Gate Chargec Gate-Source Chargec Gate-Drain Chargec Turn-On Delay Timec Rise Timec Turn-Off Delay Timec Fall Timec Ciss Coss Crss Rg Qg Qgs Qgd td(on) tr td(off) tf VDD = 15 V, RL = 0.3 W ID ^ 50 A, VGEN = 10 V, RG = 2.5 W VDS = 15 V, VGS = 4.5 V, ID = 50 A VGS = 0 V, VDS = 25 V, f = 1 MHz 3100 565 255 1.9 21 10 7.5 12 12 30 10 20 20 45 15 ns 30 nC W p pF
Source-Drain Diode Ratings and Characteristic (TC = 25_C)
Pulsed Current Diode Forward Voltageb Source-Drain Reverse Recovery Time ISM VSD trr IF = 100 A, VGS = 0 V IF = 50 A, di/dt = 100 A/ms 1.2 35 100 1.5 70 A V ns
Notes a. Guaranteed by design, not subject to production testing. b. Pulse test; pulse width v 300 ms, duty cycle v 2%. c. Independent of operating temperature.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
200 VGS = 10 thru 6 V 160 I D - Drain Current (A) 5V I D - Drain Current (A) 80 100
Transfer Characteristics
120
60
80
4V
40 TC = 125_C 20 25_C - 55_C 0
40 3V 0 0 2 4 6 8 10
0
1
2
3
4
5
VDS - Drain-to-Source Voltage (V) www.vishay.com
VGS - Gate-to-Source Voltage (V) Document Number: 71844 S-31268--Rev. B, 16-Jun-03
2
SUD50N03-06P
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Transconductance
120 TC = - 55_C 25_C 80 125_C 60 r DS(on)- On-Resistance ( W ) 0.0150
On-Resistance vs. Drain Current
100 g fs - Transconductance (S)
0.0125
0.0100 VGS = 4.5 V 0.0075 VGS = 10 V 0.0050
40
20
0.0025
0 0 10 20 30 40 50
0.0000 0 20 40 60 80 100
ID - Drain Current (A)
ID - Drain Current (A)
Capacitance
4000 3500 3000 2500 2000 1500 1000 Crss 500 0 0 5 10 15 20 25 30 Coss Ciss V GS - Gate-to-Source Voltage (V) 8 VDS = 15 V ID = 50 A 10
Gate Charge
C - Capacitance (pF)
6
4
2
0 0 10 20 30 40 50
VDS - Drain-to-Source Voltage (V)
Qg - Total Gate Charge (nC)
On-Resistance vs. Junction Temperature
2.0 VGS = 10 V ID = 20 A r DS(on)- On-Resistance ( W ) (Normalized) I S - Source Current (A) 1.5 100
Source-Drain Diode Forward Voltage
TJ = 150_C 10
TJ = 25_C
1.0
0.5
0.0 - 50
1 - 25 0 25 50 75 100 125 150 175 0 0.3 0.6 0.9 1.2 1.5 TJ - Junction Temperature (_C) VSD - Source-to-Drain Voltage (V)
Document Number: 71844 S-31268--Rev. B, 16-Jun-03
www.vishay.com
3
SUD50N03-06P
Vishay Siliconix
THERMAL RATINGS
Maximum Drain Current vs. Ambiemt Temperature
30 1000 Limited by rDS(on) 24 I D - Drain Current (A) I D - Drain Current (A) 100 10, 100 ms
Safe Operating Area
18
10
1 ms 10 ms
12
1
100 ms 1s 10 s
6
0.1
TA = 25_C Single Pulse
100 s dc
0 0 25 50 75 100 125 150 175
0.01 0.1 1 10 100 TA - Ambient Temperature (_C) VDS - Drain-to-Source Voltage (V)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2 1 Normalized Effective Transient Thermal Impedance
Duty Cycle = 0.5
0.2
0.1 0.1 0.02 0.05
Single Pulse 0.01 10 -4 10 -3 10 -2 10 -1 1 10 100 1000
Square Wave Pulse Duration (sec)
Normalized Thermal Transient Impedance, Junction-to-Case
2 Normalized Effective Transient Thermal Impedance 1 Duty Cycle = 0.5
0.2 0.1 0.1 0.02 0.05 Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1 Square Wave Pulse Duration (sec)
1
10
100
www.vishay.com
4
Document Number: 71844 S-31268--Rev. B, 16-Jun-03


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